Method for manufacturing multilayer wiring board

Provided is a method for manufacturing a multilayer wiring board, the method making it possible to extremely effectively prevent penetration of an inner layer circuit by laser processing while achieving excellent circuit adhesiveness. This method for manufacturing a multilayer wiring board comprises: (a) a step for forming a first laminate by stacking, on a first metallic foil, a first insulating layer and a second metallic foil in order; (b) a step for forming a second wiring layer; (c) a step for forming a second laminate by stacking a second insulating layer and a third metallic foil in order; (d) a step for forming a first via hole and a second via hole; and (e) a step for forming a multilayer wiring board including a first wiring layer, the second wiring layer, and a third wiring layer, wherein, regarding a surface facing at least the first insulating layer of the second metallic foil, the reflectance of a laser with a wavelength of 10.6 [mu]m, which is measured by a Fourier transform infrared spectropho