Surface treating device

A rotational surface treating device with a high treatment efficiency that allows a treatment liquid to be discharged in a short time is provided. When a treatment bath is rotated, parts contact an electrode to be electroplated. In this event, a plating liquid is used as circulated by a pump. The pl...

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Bibliographische Detailangaben
Hauptverfasser:	SHIMIZU, KOUJI, ARATANI, MASATO, HOTTA, TERUYUKI, UTSUMI, MASAYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	A rotational surface treating device with a high treatment efficiency that allows a treatment liquid to be discharged in a short time is provided. When a treatment bath is rotated, parts contact an electrode to be electroplated. In this event, a plating liquid is used as circulated by a pump. The plating liquid is discharged to the outside through a gap in a side wall for replacement of the plating liquid or the like. During discharge, the plating liquid is not circulated by the pump. The gap which is formed in the side wall is formed to be smaller than the minimum dimension of the parts on the inner side. The gap is formed to be wider toward the outer side. Thus, water is discharged immediately.