Resin composition for wafer grade packaging and sealing capable of reducing warpage of a substrate after being sealed and excellent in fluidity

A problem to be solved by the present invention is to provide a resin composition for wafer grade packaging and sealing resin, which is capable of reducing warpage of a substrate after being sealed and excellent in fluidity. The solution of the problem is a resin composition for wafer grade packagin...

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Bibliographische Detailangaben
Hauptverfasser:	SASAKI, MINORU, OGINO, KEIJI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A problem to be solved by the present invention is to provide a resin composition for wafer grade packaging and sealing resin, which is capable of reducing warpage of a substrate after being sealed and excellent in fluidity. The solution of the problem is a resin composition for wafer grade packaging and sealing, which comprises a specific first epoxy resin which is in a liquid form at 25 DEG C and the epoxy equivalence is from 250 to 100, and the viscosity at 25 DEG C is 20 Ps.S, a specific second epoxy resin having an epoxy equivalence less than that of the first epoxy resin, and 80 or more but less than 250, a thiol compound having two or more thiol groups in the molecule, and an inorganic filler.