Method for producing molded body and method for producing electronic component device

A method for producing a molded body includes: depressurizing an atmosphere inside a container in which a resin composition in a solid state is placed; heating and melting the resin composition after the depressurizing of the atmosphere inside the container; and bringing the atmosphere inside the co...

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Bibliographische Detailangaben
Hauptverfasser:	ARATA, MICHITOSHI, TOGAWA, MITSUO, MURASUGI, NARUTOSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A method for producing a molded body includes: depressurizing an atmosphere inside a container in which a resin composition in a solid state is placed; heating and melting the resin composition after the depressurizing of the atmosphere inside the container; and bringing the atmosphere inside the container in which the melted resin composition is placed closer to atmospheric air pressure.