Composition and solution for temporary bonding

A composition and a solution for temporary bonding are provided. The composition includes a dianhydride monomer, a light-absorption monomer and a light-absorption material. The light-absorption monomer includes DPDA and TPDA. The light-absorption material includes carbon black and silicon dioxide.

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Bibliographische Detailangaben
Hauptverfasser:	LIN, PO-WEN, HSIAO, LI-JUNG, HUNG, TSUNG-TAI, CHANG, HSIU-MING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A composition and a solution for temporary bonding are provided. The composition includes a dianhydride monomer, a light-absorption monomer and a light-absorption material. The light-absorption monomer includes DPDA and TPDA. The light-absorption material includes carbon black and silicon dioxide.