Carrier substrate and printed circuit board fabricated using the same

A printed circuit board divided into a rigid portion and a flexible portion in accordance with an aspect of the present invention includes: flexible adhesive layer; first flexible insulating layer and second flexible insulating layer laminated, respectively, on an upper surface and a lower surface of the flexible adhesive layer; rigid insulating layer formed on the first flexible insulating layer and the second flexible insulating layer in correspondence with the rigid portion; first circuit embedded in the lower surface of the flexible adhesive layer and having one surface thereof in contact with the second flexible insulating layer and having remaining surfaces thereof surrounded by the flexible adhesive layer; second circuit formed on an upper surface of the first flexible insulating layer and a lower surface of the second flexible insulating layer; and third circuit formed on the rigid insulating layer.