Etchant composition not containing fluorine capable of controlling molybdenum residue and avoiding undercut when etching a molybdenum-copper alloy film

The present invention discloses a molybdenum-copper alloy film etchant composition not containing fluorine which is used in a liquid crystal display device, an organic light emitting diode display device, or the like. The molybdenum-copper alloy film etchant composition includes an etchant compositi...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, GYU-PO, SHIN, HYUNOL, HWANG, JUN-YOUNG, LEE, DAE-WOO, LEE, SANG-HYUK
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL DYES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NATURAL RESINS NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PAINTS POLISHES
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