Semiconductor surface treatment composition and semiconductor surface treatment method capable of effectively reducing or removing contaminants from the surface of a semiconductor when being used for treatment such as polishing or cleaning

The present invention provides a semiconductor surface treatment composition, which is capable of effectively reducing or removing contaminants from the surface of a semiconductor when being used for treatment such as polishing or cleaning, and is hard to corrode metal such as metal wiring, and a me...

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Bibliographische Detailangaben
Hauptverfasser:	NARUSE, HIDENORI, MITSUMOTO, KIYOTAKA, MIURA, TAKUYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CANDLES CHEMISTRY CINEMATOGRAPHY DETERGENT COMPOSITIONS DETERGENTS DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FATTY ACIDS THEREFROM FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING HOLOGRAPHY MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORIGINALS THEREFOR PAINTS PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHES POLISHING RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SOAP OR SOAP-MAKING TRANSPORTING USE OF SINGLE SUBSTANCES AS DETERGENTS
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Beschreibung
Zusammenfassung:	The present invention provides a semiconductor surface treatment composition, which is capable of effectively reducing or removing contaminants from the surface of a semiconductor when being used for treatment such as polishing or cleaning, and is hard to corrode metal such as metal wiring, and a method of using the same. A semiconductor surface treatment composition includes: (A) a polymer including a polymer chain having repeating units represented by the following formula (1); and (B) a chelating agent having a molecular weight of 500 or less: In formula (1), R1 represents a hydrogen atom or a methyl group; Z represents an organic ammonium salt-forming group, -NR5R6 (wherein R5 and R6 each independently represents a hydrogen atom, or a substituted or unsubstituted hydrocarbon group), or a substituted or unsubstituted nitrogen-containing heterocyclic group; X represents a single bond or a divalent linking group.