Method for producing a micromechanical layer structure
The invention relates to a method for producing a micromechanical layer structure, comprising the following steps: Providing a first protective layer, wherein the first protective layer is patterned with at least one access filled with sacrificial layer material, Applying a functional-layer layer st...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a method for producing a micromechanical layer structure, comprising the following steps: Providing a first protective layer, wherein the first protective layer is patterned with at least one access filled with sacrificial layer material, Applying a functional-layer layer structure, comprising at least one functional layer, on the first protective layer, Producing a first access in the functional-layer layer structure to the at least one access of the first protective layer, such that a width of the first access in the functional-layer layer structure in at least one of the layers of the functional-layer layer structure is greater than or equal to the width of the at least one access of the first protective layer, Applying a second protective layer on the functional-layer layer structure in such a way that the first access is filled with material of the second protective layer, Patterning the second protective layer and the filled first access with a second access to the first protect |
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