Curable resin composition for unpressurized sealing of a case module, semiconductor device, and method of producing semiconductor device

A curable resin composition for unpressurized sealing of a case module is in solid form at 25 DEG C, and has a gel time of 10 minutes or more at 110 DEG C.

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Bibliographische Detailangaben
Hauptverfasser:	ARATA, MICHITOSHI, TOGAWA, MITSUO, ONO, YUTA, MURASUGI, NARUTOSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A curable resin composition for unpressurized sealing of a case module is in solid form at 25 DEG C, and has a gel time of 10 minutes or more at 110 DEG C.