System and method for chip-on-board light emitting diode

An LED array mounted on a circuit board comprising a plurality of LED chips embedded in an encapsulant. Each LED chip is placed inside a cavity which is made up solely from a multilayer foil and attached to the circuit board with an adhesive film. The foil cavity design enables a variety of mounted...

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Bibliographische Detailangaben
Hauptverfasser:	VAN HAECKE, STEPHANIE CYRIEL ADRIANNA, BONTINCK, FLORIS ALBERT, MLADENOVSKI, SASO, WINDELS, JINDRICH, LAMBERT, JASPER IRENE, JABLONSKI, MICHAL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An LED array mounted on a circuit board comprising a plurality of LED chips embedded in an encapsulant. Each LED chip is placed inside a cavity which is made up solely from a multilayer foil and attached to the circuit board with an adhesive film. The foil cavity design enables a variety of mounted LED arrays to be manufactured with the same process.