Movable protection mechanism for electroplating apparatus capable of adjusting the height according to the size of the plate body to be plated

The invention provides a movable protection mechanism of an electroplating apparatus, which is disposed in a plating tank. Plate bodies for electroplating in the protective plating tank comprise: a plurality of sets of first grid units arranged one behind the other, the first grid unit has two piece...

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1. Verfasser: XU, WU-QUAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a movable protection mechanism of an electroplating apparatus, which is disposed in a plating tank. Plate bodies for electroplating in the protective plating tank comprise: a plurality of sets of first grid units arranged one behind the other, the first grid unit has two pieces of upright first grids; the second grid unit has a plurality of sets of second grid units arranged one behind the other, among which two pieces of second grids are respectively connected to the upper ends of the first grids; a moving passage through which the plate body passes between the two first and second grids is formed; a driving mechanism is formed for driving the first and second grid units to lift and lower, which causes the two pieces of second grids to swing and then open toward two sides of the plating tank when it is lifting, and to swing and then close toward the moving passage when it is lowering; accordingly, a movable protection mechanism is constructed, so that the height of the plate can be adj