Substrate processing system, substrate processing method, program, and computer storage medium

When removing the peripheral portion of a substrate by grinding, the present invention reduces the time taken to remove the peripheral portion, and improves the surface properties of the substrate surface exposed by grinding of the peripheral portion. A substrate processing system 1 that processes a processing target wafer comprises: a first peripheral portion removal section 210 which includes a first grindstone that contacts the peripheral portion of the processing target wafer and grinds away the peripheral portion to a first depth; and a second peripheral portion removal section 230 which includes a second grindstone that contacts the peripheral portion of the processing target wafer, and after grinding of the peripheral portion by the first peripheral part removal section 210, further grinds away the peripheral portion to a second depth that is deeper than the first depth. The grain size of the grains on the second grindstone is smaller than the grain size of the grains on the first grindstone.