Memory heat-dissipating device

The invention discloses a memory heat-dissipating device which includes a first heat dissipating sheet, a second heat dissipating sheet, a plurality of fins, and a C-shaped clamping part. The C-shaped clamping part can clamp the first heat dissipating sheet and the second heat dissipating sheet on two opposite heating surfaces of a memory module for dissipating heat produced by the memory module. The plurality of fins extend outward from the first heat dissipating sheet relative to the second heat dissipating sheet. The plurality of fins form a clamp slot therebetween. When the C-shaped clamping part clamps the first heat dissipating sheet and the second heat dissipating sheet on the memory module, the C-shaped clamping part is located in the clamp slot.