Vapor deposition mask, vapor deposition mask manufacturing method, and display device manufacturing method

The vapor deposition mask is provided with: an obverse surface; a reverse surface located on the side opposite from the obverse surface; and inner surfaces that each demarcates a mask hole. Each mask hole penetrates between the obverse surface and the reverse surface. In plan view of the obverse sur...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	NISHI, TAKEHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The vapor deposition mask is provided with: an obverse surface; a reverse surface located on the side opposite from the obverse surface; and inner surfaces that each demarcates a mask hole. Each mask hole penetrates between the obverse surface and the reverse surface. In plan view of the obverse surface, each mask hole has a large opening located on the obverse surface and a small opening located on the inside of the large opening. At least a part of each mask hole has an inverted cylindrical frustum-like shape connecting the large opening with the small opening. Each of the inner surfaces has a stepped surface expanding from the small opening toward the large opening.