Low K dielectric compositions for high frequency applications

A low K value, high Q value, low firing dielectric material and method of forming a fired dielectric material is presented. The dielectric material can be fired below 950 DEG C or below 1100 DEG C, has a K value of less than about 8 at 10-30 GHz and a Q value of greater than 500 or greater than 1000...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	WANG, STANLEY ZHING, WIDLEWSKI, DAVID L, MALONEY, JOHN J, MARLEY, PETER, SAKOSKE, GEORGE E, COFFEY, THOMAS JOSEPH, BROWN, ORVILLE W, TORMEY, ELLEN S, MEGHERHI, MOHAMMED H, GLEASON, CODY J, SRIDHARAN, SRINIVASAN, DAVIS, JACKIE D, HER, YIE-SHEIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CABLES CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CEMENTS CERAMICS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE CONDUCTORS ELECTRICITY GLASS INSULATORS JOINING GLASS TO GLASS OR OTHER MATERIALS LIME, MAGNESIA MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METALLURGY MINERAL OR SLAG WOOL REFRACTORIES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SLAG SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TREATMENT OF NATURAL STONE
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A low K value, high Q value, low firing dielectric material and method of forming a fired dielectric material is presented. The dielectric material can be fired below 950 DEG C or below 1100 DEG C, has a K value of less than about 8 at 10-30 GHz and a Q value of greater than 500 or greater than 1000 at 10-30 GHz. The dielectric material includes, before firing a solids portion including 10-95 wt% or 10-99 wt% silica powder and 5-90 wt% or 1-90 wt% glass component. The glass component includes 50-90 mole% SiO2, 5-35 mole% or 0.1-35 mole% B2O3, 0.1-10 mole% or 0.1-25 mole% Al2O3, 0.1-10 mole% K2O, 0.1-10 mole% Na2O, 0.1-20 mole% Li2O, 0.1-30 mole% F. The total amount of Li2O + Na2O + K2O is 0.1-30 mole% of the glass component. The silica powder can be amorphous or crystalline.