Light emitting diode

A light emitting diode includes a carrier, a chip and a coating material. The carrier includes a conductive area and an insulating area. The conductive area has an upper surface and a lower surface. The insulating area covers a part of the conductive area. The conductive area includes at least one f...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LU, TSUNG-LIN, YU, WEI-TYNG, YU, PYNG, CHEN, KUO-YANG, LIN, CHIH-MIN, LEE, SHENU, LAI, JEN-HSIUNG, PAN, KE-HAO, LEE, WEI-TING
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A light emitting diode includes a carrier, a chip and a coating material. The carrier includes a conductive area and an insulating area. The conductive area has an upper surface and a lower surface. The insulating area covers a part of the conductive area. The conductive area includes at least one first contact area on its lower surface where not covered by the insulating area. A first spacing is provided between the adjacent first contact areas. The conductive area also includes at least one second contact area on its upper surface where not covered by the insulating area. A second spacing is provided between the adjacent second contact areas. The first spacing is greater than the second spacing. The chip is electrically connected to the carrier by the conductive area. The coating material at least covers a surface of the chip away from the carrier.