Device for depositing a structured layer on a substrate with use of a mask

The invention relates to a device for depositing layers that are laterally structured by the use of masks on at least one substrate (20), in particular by feeding a vapour into a deposition chamber (19) and condensing the vapour on the substrate (20), said device having a substrate holder (21), cool...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	KEIPER, DIETMAR
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The invention relates to a device for depositing layers that are laterally structured by the use of masks on at least one substrate (20), in particular by feeding a vapour into a deposition chamber (19) and condensing the vapour on the substrate (20), said device having a substrate holder (21), coolable by means of coolants (22), for holding the substrate (20) and a mask (8) secured to a mask frame (10) for positioning on the substrate (20). Measures are described, by means of which precisely structured layers can be deposited reproducibly on the substrate. The mask frame (10) is surrounded by a heating frame (25) heated by means of heating media (18). Thermal insulating means are provided between the mask frame (10) and heating frame (25). The invention further relates to a method for depositing layers with use of a device of the type in question.