A latent, fast curing composition, a use thereof and an article having a cured composition obtainable therefrom

The problem to be solved by the present invention is the provision of an epoxy resin-based latent curing composition having fast cure performance. The solution therefor is a latent curing composition comprising (A) an epoxy resin; and (B) an imidazole curing agent having at least one primary amine g...

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Bibliographische Detailangaben
Hauptverfasser:	LIM, JIN-HONG, SONG, JUNG-HO, YEOM, JAE-GWAN, KIM, CHONG-YOUP
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The problem to be solved by the present invention is the provision of an epoxy resin-based latent curing composition having fast cure performance. The solution therefor is a latent curing composition comprising (A) an epoxy resin; and (B) an imidazole curing agent having at least one primary amine group.