Mold release film for use in mold formation and mold formation method

Provided are: a mold release film that is for use in mold formation, and that is characterized by being provided with a mold release layer comprising composition (I) or composition (II) disposed on a base material film; and a mold formation method using same. Composition (I) comprises: a compound (a...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TSUJIUCHI, NAOKI, NAKAGAKI, TAKAMITSU, SUGIYAMA, RYUICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided are: a mold release film that is for use in mold formation, and that is characterized by being provided with a mold release layer comprising composition (I) or composition (II) disposed on a base material film; and a mold formation method using same. Composition (I) comprises: a compound (a) containing an alkyl group having eight or more carbon atoms; and a crosslinking agent (b). Composition (II) comprises a compound ([alpha]) that contains an alkyl group having eight or more carbon atoms and an ethylenically unsaturated group. By this configuration, it is possible to provide an inexpensive mold release film that is for use in mold formation and that exhibits favorable release properties after the hardening of a sealing material in the process of mold formation.