Polyimine film having excellent flexibility and size stability used in flexible printed circuit board

The present invention provides a novel polyimide film which can be suitably used for a metal wiring substrate or a multilayer structure substrate in which wiring is formed in different directions. In the first embodiment of the polyimide film, the thermal expansion coefficient ([alpha]TMD) in the MD...

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Bibliographische Detailangaben
Hauptverfasser:	OGURA, MIKIHIRO, WAGATSUMA, RYOUSAKU, HIRAMATSU, NAOHIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides a novel polyimide film which can be suitably used for a metal wiring substrate or a multilayer structure substrate in which wiring is formed in different directions. In the first embodiment of the polyimide film, the thermal expansion coefficient ([alpha]TMD) in the MD direction and the thermal expansion coefficient ([alpha]TTD) in the TD direction are both set to 2 to 7 ppm/DEG C, and \|[alpha]TMD-[alpha]TTD\| is set to 2 ppm/DEG C or less; The humidity expansion coefficient ([alpha]HMD) in the MD direction and the humidity expansion coefficient ([alpha]HTD) in the TD direction are both set to 3 to 16 ppm/% RH, and \|[alpha]HMD-[alpha]HTD\| is set to 5 ppm/% RH or less. In the second embodiment of the polyimide film, the tensile elasticity modulus (EMD) in the MD direction and the tensile elasticity modulus (ETD) in the TD direction are all set to 5 to 9 GPa, and \|EMD-ETD\| is set to 2 GPa or less, and the in-plane anisotropy index (MT ratio) is set to 13 or less, and both the stati