Position detection device and vapor deposition apparatus capable of improving the detection accuracy of the position of a substrate

The present invention provides a position detection device and a vapor deposition apparatus capable of improving the detection accuracy of the position of a substrate. The position detection device 10 includes: an imaging unit 11 for capturing a first image, which is formed by the light reflected fr...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	BANNAI, YUYA, YANAGIHORI, FUMITSUGU, YOSHIDA, YUICHI, OGAWA, KEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention provides a position detection device and a vapor deposition apparatus capable of improving the detection accuracy of the position of a substrate. The position detection device 10 includes: an imaging unit 11 for capturing a first image, which is formed by the light reflected from a flat portion Wp1 of a substrate W, and a second image, which is formed by the light reflected from an oblique angle portion Wp2 connected to the flat portion Wp1; and an image processing portion 12 for extracting the boundary of the flat portion Wp1 and the oblique angle portion Wp2 based on the contrast of the first image and the second image to serve as part of the outer shape of the substrate W, and determining the position of the substrate W based on the part of the extracted outer shape.