Ingot slicing method and slicing abrasive kit

An ingot slicing method includes: providing a softener composition and a plurality of slicing abrasives, in which the softener composition includes a carrier reagent and a plurality of reactive abrasives dispersed in the carrier reagent; moving an ingot along a slicing path with respect to a wire; c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HSIEH, CHI-HSIANG, SHIH, YING-RU, LO, HUNGANG, CHEN, CHAOANG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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