Ingot slicing method and slicing abrasive kit

An ingot slicing method includes: providing a softener composition and a plurality of slicing abrasives, in which the softener composition includes a carrier reagent and a plurality of reactive abrasives dispersed in the carrier reagent; moving an ingot along a slicing path with respect to a wire; contacting the ingot to the plurality of reactive abrasives to interactively perform a solid phase chemical reaction so that an outer surface layer of the ingot is formed as a solid phase chemical reaction layer which has a hardness less than that of the ingot; contacting the ingot to the plurality of slicing abrasives for a slicing procedure: using the plurality of slicing abrasives to slice the solid phase chemical reaction layer to form a plurality of slicing grooves; contacting the plurality of reactive abrasives to the ingot along the slicing path continuously so that the bottom of each slicing groove is continuously formed into the solid phase chemical reaction layer and the plurality of slicing abrasives are