Semiconductor chip pickup device, semiconductor chip packaging device and packaging method capable of stably peeling a semiconductor chip from an adhesive sheet

This invention aims to stably peel a semiconductor chip from an adhesive sheet. This invention relates to a semiconductor chip pickup device that picks up a semiconductor chip t adhered and held on an adhesive sheet 11 from the adhesive sheet 11, comprising: a pickup mechanism 40 for picking up the semiconductor chip t from the adhesive sheet 11; a push-up mechanism 60 having a plurality of push-up bodies 62a to 62d disposed so as to be movable relative to each other in the axial direction to have the same axial center, wherein a negative pressure is applied to the portion of the adhesive sheet 11 where the semiconductor chip t to be picked up is located from the side opposite to the semiconductor chip t, when the semiconductor chip t is picked up by the pickup mechanism, the semiconductor chip t is pushed upward by the plurality of push-up bodies 62a to 62d; and a negative pressure adjustment mechanism 63b for setting the magnitude of the negative pressure to -85 kPa or less in gauge pressure.