Bonding device and bonding method

The present disclosure relates to a bonding device used for bonding a first workpiece and a second workpiece. A first mask is formed on the first workpiece. A second mask is corresponded to the first mark and is formed on the second workpiece. The bonding device comprises an upper bonding module, a...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HUANG, KUOIH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CALCULATING COMPUTING COUNTING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC DIGITAL DATA PROCESSING FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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