Bonding device and bonding method
The present disclosure relates to a bonding device used for bonding a first workpiece and a second workpiece. A first mask is formed on the first workpiece. A second mask is corresponded to the first mark and is formed on the second workpiece. The bonding device comprises an upper bonding module, a...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present disclosure relates to a bonding device used for bonding a first workpiece and a second workpiece. A first mask is formed on the first workpiece. A second mask is corresponded to the first mark and is formed on the second workpiece. The bonding device comprises an upper bonding module, a lower bonding module, and an image acquisition module. The upper bonding module is used for fixing the first workpiece. The upper bonding module has a window area. A double-side coated quartz glass is formed in the window area. A refraction angle of light of the double-side coated quartz glass is smaller than a refraction angle of light of a normal quartz glass. The image acquisition module has a deep vision lens. The deep vision lens is used for simultaneously extracting the vision of the first mask and the second mark. The lower bonding module is used for fixing the second workpiece. The lower bonding module and the upper bonding module cooperatively form a vacuum chamber. The first workpiece and the second workp |
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