On-line automated film thickness measurement method capable of increasing resolution and reducing errors caused by machine vibration to achieve more accurate measurement data

The present invention comprises a base, a film placing member and a measuring assembly. In which, the film placing member is mounted on the base. The measuring assembly is movably coupled with the base, and comprises a capacitive displacement sensor and an eddy current displacement sensor. The measu...

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1. Verfasser: CHEN, XIN-MAO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present invention comprises a base, a film placing member and a measuring assembly. In which, the film placing member is mounted on the base. The measuring assembly is movably coupled with the base, and comprises a capacitive displacement sensor and an eddy current displacement sensor. The measurement assembly of the present invention is configured with the capacitive displacement sensor and the eddy current displacement sensor. The present invention provides an on-line automated film thickness measurement method to solve the problem of the measurement error caused by the eddy current displacement sensor and the capacitive displacement sensor, and is able to solve the problems that the existed film thickness measurement devices have low resolution and are easily affected by the machine vibration during dynamic measurement causing errors. The present invention provides an on-line automated film thickness measurement device and thickness measurement method to measure the film thickness using the capacitive