Semiconductor wafer analyzing system and method thereof

The present invention provides a wafer analyzing system, comprising: a conveyor device and a defect analyzing device, wherein the defect analyzing device comprises: an image capturing module and a processing module electrically connected with the image capturing module. The conveyor device delivers...

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Bibliographische Detailangaben
1. Verfasser: LUOH, LEH
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present invention provides a wafer analyzing system, comprising: a conveyor device and a defect analyzing device, wherein the defect analyzing device comprises: an image capturing module and a processing module electrically connected with the image capturing module. The conveyor device delivers a wafer to the defect analyzing device and then the image capturing module captures an original image of the wafer. The processing module processes a defect analysis according to the original image, wherein the defect analysis comprises: performing a de-background and localization process; performing a partition and parameterization process to a parameter matrix; comparing the parameter matrix with a standard matrix to get a parameter difference; classifying the parameter difference with a classification database; and outputting a analysis result of the wafer. The present invention also provides a wafer analyzing method thereof.