Electronic package and the manufacture thereof

Electronic package and the manufacture thereof

The present invention provides an electronic package and a fabrication method thereof, the method including: connecting a first carrier structure with an electronic element via a bonding layer formed thereon; stacking the first carrier structure on a second carrier structure by a plurality of conduc...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIANG, JAU-EN, CHEN, HSIN-LONG, TSAI, KUOING
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The present invention provides an electronic package and a fabrication method thereof, the method including: connecting a first carrier structure with an electronic element via a bonding layer formed thereon; stacking the first carrier structure on a second carrier structure by a plurality of conductive elements; and electrically connecting the electronic element to the second carrier structure to thereby maintain and secure the distance between the first and second carrier structures.