Epoxy resin composition for sealing and electronic component apparatus

A epoxy resin composition for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator and (D) inorganic fillers, and the (D) inorganic fillers includes alumina of from 75 % by mass to 98 % by mass with respect to the total amount of the inorganic fillers.

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TANAKA, MIKA, KAN, DONORU, YAMAURA, MASASHI, HORI, KEICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A epoxy resin composition for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator and (D) inorganic fillers, and the (D) inorganic fillers includes alumina of from 75 % by mass to 98 % by mass with respect to the total amount of the inorganic fillers.