Heat dissipating system and operating method thereof

A heat dissipating system includes a driving chip and a heat dissipating device electrically connected to the driving chip. The heat dissipating device includes a carrier, a magnetic driver fixed on the carrier, and at least one swing structure fixed on the carrier. The driving chip is configured to implement a testing function by sequentially transporting a plurality of testing signals of different frequencies to the magnetic driver, thereby obtaining the value of each current traveling in the magnetic driver corresponding to the respective testing signal. The lowest value of current obtained by implementing the testing function is defined as an operation current value, and the testing signal corresponding to the operation current value is defined as a driving signal. The driving chip is configured to implement a driving function by continuously transporting the driving signal to the magnetic driver, so that the magnetic driver is in an operation mode to swing the swing structure. In addition, the present di