Liquid epoxy resin sealing material and semiconductor device

Provided are: a liquid epoxy resin sealing material which does not undergo fillet cracking that can occur when an underfill cured product is allowed to leave under high-temperature aerobic conditions; and a semiconductor device using the liquid epoxy resin sealing material. A liquid epoxy resin seal...

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Bibliographische Detailangaben
Hauptverfasser:	SASAGE, NOZOMU, HOSONO, YOHEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Provided are: a liquid epoxy resin sealing material which does not undergo fillet cracking that can occur when an underfill cured product is allowed to leave under high-temperature aerobic conditions; and a semiconductor device using the liquid epoxy resin sealing material. A liquid epoxy resin sealing material containing (A) a liquid epoxy resin, (B) an amine curing agent, (C) an inorganic filler and (D) an antioxidant agent represented by formula, wherein the antioxidant agent (D) is contained in an amount of 0.5 to 10 parts by mass relative to the total amount, i.e., 100 parts by mass, of the epoxy resin (A) and the amine curing agent (B); and a semiconductor device using the liquid epoxy resin sealing material.