Method of manufacturing semiconductor package
A method of manufacturing a semiconductor device includes providing a wafer; forming a die having a size smaller than one over two of a standard size of 0201 in and on the wafer; obtaining the die by sawing the wafer; and singulating the die as a package. Size of the package is equal to or larger th...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A method of manufacturing a semiconductor device includes providing a wafer; forming a die having a size smaller than one over two of a standard size of 0201 in and on the wafer; obtaining the die by sawing the wafer; and singulating the die as a package. Size of the package is equal to or larger than the standard size of 0201. |
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