Method for forming circuits using seed layer and etchant composition for selective etching of seed layer

The present application relates to a method for forming circuits using a seed layer. The method according to the present application is characterized by being capable of implementing the fine pitches, increasing the adhesion of the circuit, and preventing the migration phenomenon.

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Bibliographische Detailangaben
Hauptverfasser:	SEONG, HYEON-JUN, MOON, BYUNG-WOONG, MOON, JUNG-YOON, KIM, JAE-RIN, KIM, SU-HAN, CHUNG, KWANGOON
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	The present application relates to a method for forming circuits using a seed layer. The method according to the present application is characterized by being capable of implementing the fine pitches, increasing the adhesion of the circuit, and preventing the migration phenomenon.