Thermosetting flux composition and method for manufacturing electronic substrate in which the thermosetting flux composition is excellent in insulating property of a cured product, soldering capability in reflowing, and self-alignment property

The thermosetting flux composition of the present invention is characterized in being used for a case in which an electronic component having a solder bump including a solder alloy with a melting point of 200 DEG C or more and 240 DEG C or less is joined to an electronic substrate by reflow solderin...

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Bibliographische Detailangaben
Hauptverfasser:	TANIGUCHI, HIROAKI, IIJIMA, NORISHIGE, KITAMURA, AKIRA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The thermosetting flux composition of the present invention is characterized in being used for a case in which an electronic component having a solder bump including a solder alloy with a melting point of 200 DEG C or more and 240 DEG C or less is joined to an electronic substrate by reflow soldering and contains (A) an oxetane compound and (B) an activator. The component (A) contains (A1) a bifunctional oxetane compound having two oxetane rings in one molecule, and the component (B) contains (B1) an organic acid. Furthermore, the thermosetting flux composition has a viscosity of 5 Pas or less at a temperature of 200 DEG C in the case of elevating temperature from a temperature of 25 DEG C at a temperature elevation rate of 5 DEG C/min, and has a viscosity of 50 Pas or more at a temperature of 250 DEG C.