Wireless package and fabrication method thereof

A wireless package includes a package substrate, a RFIC chip, a resilient connector, a molding compound encapsulating the RFIC chip, the resilient connector, and the top surface of the package substrate, and an antenna disposed on a top surface of the molding compound. The resilient connector has a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHANG, SHU-WEI, HU, CHUN-FU, HU, CHIH-YU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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