Wireless package and fabrication method thereof

Wireless package and fabrication method thereof

A wireless package includes a package substrate, a RFIC chip, a resilient connector, a molding compound encapsulating the RFIC chip, the resilient connector, and the top surface of the package substrate, and an antenna disposed on a top surface of the molding compound. The resilient connector has a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHANG, SHU-WEI, HU, CHUN-FU, HU, CHIH-YU
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A wireless package includes a package substrate, a RFIC chip, a resilient connector, a molding compound encapsulating the RFIC chip, the resilient connector, and the top surface of the package substrate, and an antenna disposed on a top surface of the molding compound. The resilient connector has a terminal bonded to a pad on the top surface of the package substrate, a horizontal contact portion, and an oblique support portion integrally coupled to the horizontal contact portion and extending between the horizontal contact portion and the terminal. The antenna is in direct contact with the horizontal contact portion.