Semiconductor package and fabricating method thereof
A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor de...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KO, YEOUNG-BEOM KIM, JOON-DONG KIM, HEE-SUNG LEE, JAE-JIN KIM, DONG-JEAN KANG, DAE-BYOUNG |
| description | A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW201834163A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW201834163A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW201834163A3</originalsourceid><addsrcrecordid>eNrjZDAJTs3NTM7PSylNLskvUihITM5OTE9VSMxLUUhLTCrKTE4sycxLV8hNLcnIT1EoyUgtSs1P42FgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcVAQ1LzUkviQ8KNDAwtjE0MzYwdjYlRAwBSdC0t</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Semiconductor package and fabricating method thereof</title><source>esp@cenet</source><creator>KO, YEOUNG-BEOM ; KIM, JOON-DONG ; KIM, HEE-SUNG ; LEE, JAE-JIN ; KIM, DONG-JEAN ; KANG, DAE-BYOUNG</creator><creatorcontrib>KO, YEOUNG-BEOM ; KIM, JOON-DONG ; KIM, HEE-SUNG ; LEE, JAE-JIN ; KIM, DONG-JEAN ; KANG, DAE-BYOUNG</creatorcontrib><description>A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180916&DB=EPODOC&CC=TW&NR=201834163A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180916&DB=EPODOC&CC=TW&NR=201834163A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KO, YEOUNG-BEOM</creatorcontrib><creatorcontrib>KIM, JOON-DONG</creatorcontrib><creatorcontrib>KIM, HEE-SUNG</creatorcontrib><creatorcontrib>LEE, JAE-JIN</creatorcontrib><creatorcontrib>KIM, DONG-JEAN</creatorcontrib><creatorcontrib>KANG, DAE-BYOUNG</creatorcontrib><title>Semiconductor package and fabricating method thereof</title><description>A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAJTs3NTM7PSylNLskvUihITM5OTE9VSMxLUUhLTCrKTE4sycxLV8hNLcnIT1EoyUgtSs1P42FgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcVAQ1LzUkviQ8KNDAwtjE0MzYwdjYlRAwBSdC0t</recordid><startdate>20180916</startdate><enddate>20180916</enddate><creator>KO, YEOUNG-BEOM</creator><creator>KIM, JOON-DONG</creator><creator>KIM, HEE-SUNG</creator><creator>LEE, JAE-JIN</creator><creator>KIM, DONG-JEAN</creator><creator>KANG, DAE-BYOUNG</creator><scope>EVB</scope></search><sort><creationdate>20180916</creationdate><title>Semiconductor package and fabricating method thereof</title><author>KO, YEOUNG-BEOM ; KIM, JOON-DONG ; KIM, HEE-SUNG ; LEE, JAE-JIN ; KIM, DONG-JEAN ; KANG, DAE-BYOUNG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW201834163A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KO, YEOUNG-BEOM</creatorcontrib><creatorcontrib>KIM, JOON-DONG</creatorcontrib><creatorcontrib>KIM, HEE-SUNG</creatorcontrib><creatorcontrib>LEE, JAE-JIN</creatorcontrib><creatorcontrib>KIM, DONG-JEAN</creatorcontrib><creatorcontrib>KANG, DAE-BYOUNG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KO, YEOUNG-BEOM</au><au>KIM, JOON-DONG</au><au>KIM, HEE-SUNG</au><au>LEE, JAE-JIN</au><au>KIM, DONG-JEAN</au><au>KANG, DAE-BYOUNG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor package and fabricating method thereof</title><date>2018-09-16</date><risdate>2018</risdate><abstract>A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_TW201834163A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Semiconductor package and fabricating method thereof |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-25T14%3A28%3A28IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KO,%20YEOUNG-BEOM&rft.date=2018-09-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW201834163A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |