Semiconductor package and fabricating method thereof

A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor de...

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Bibliographische Detailangaben
Hauptverfasser: KO, YEOUNG-BEOM, KIM, JOON-DONG, KIM, HEE-SUNG, LEE, JAE-JIN, KIM, DONG-JEAN, KANG, DAE-BYOUNG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.