Electronic package
An electronic package has a conductive layer disposed on a surface of a carrying structure and designed to have a non-continuous pattern. Therefore, the conductive layer has a reduced layout area, and the amount of solder paste used to solder the conductive layer to a shielding member is also reduce...
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| creator | COIU, PIN-RUEI HUANG, YENIEH KUO, CHI-HSIN CHANG, YI-FENG TSAI, FANG-LIN |
| description | An electronic package has a conductive layer disposed on a surface of a carrying structure and designed to have a non-continuous pattern. Therefore, the conductive layer has a reduced layout area, and the amount of solder paste used to solder the conductive layer to a shielding member is also reduced, so as to avoid excess solder paste from flowing to an external surface of the electronic package along the shielding member during a reliability testing process. |
| format | Patent |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Electronic package |
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