Electronic package

Electronic package

An electronic package has a conductive layer disposed on a surface of a carrying structure and designed to have a non-continuous pattern. Therefore, the conductive layer has a reduced layout area, and the amount of solder paste used to solder the conductive layer to a shielding member is also reduce...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: COIU, PIN-RUEI, HUANG, YENIEH, KUO, CHI-HSIN, CHANG, YI-FENG, TSAI, FANG-LIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic package has a conductive layer disposed on a surface of a carrying structure and designed to have a non-continuous pattern. Therefore, the conductive layer has a reduced layout area, and the amount of solder paste used to solder the conductive layer to a shielding member is also reduced, so as to avoid excess solder paste from flowing to an external surface of the electronic package along the shielding member during a reliability testing process.