A thermally curable sealant composition

This invention relates to a thermally curable sealant composition and use thereof. In particular, the invention relates to a thermally curable sealant composition comprising one or more thermally curable resins having a group selected from epoxy group, (meth)acryloyl group, maleimide group, and comb...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WANG, MING-HAI, LI, LEI, LIU, QI, GAO, BAO-SHAN
Format: Patent
Sprache:chi ; eng
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