A thermally curable sealant composition
This invention relates to a thermally curable sealant composition and use thereof. In particular, the invention relates to a thermally curable sealant composition comprising one or more thermally curable resins having a group selected from epoxy group, (meth)acryloyl group, maleimide group, and comb...
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Format: | Patent |
Sprache: | chi ; eng |
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