A thermally curable sealant composition

This invention relates to a thermally curable sealant composition and use thereof. In particular, the invention relates to a thermally curable sealant composition comprising one or more thermally curable resins having a group selected from epoxy group, (meth)acryloyl group, maleimide group, and comb...

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Bibliographische Detailangaben
Hauptverfasser: WANG, MING-HAI, LI, LEI, LIU, QI, GAO, BAO-SHAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:This invention relates to a thermally curable sealant composition and use thereof. In particular, the invention relates to a thermally curable sealant composition comprising one or more thermally curable resins having a group selected from epoxy group, (meth)acryloyl group, maleimide group, and combination thereof, and a latent curing agent, in which the molar equivalent ratio of epoxy group to (meth)acryloyl group and/or maleimide group in the one or more thermally curable resins is from 0.1 to 5.0. The thermally curable sealant composition possess an excellent gel time at elevated temperature and an improved resistance to liquid crystal penetration and liquid crystal contamination, a good adhesion and a good reliability.