Method of manufacturing a semiconductor structure

Method of manufacturing a semiconductor structure

A method of manufacturing a semiconductor structure is provided. The method includes depositing a conductive material over a substrate, and removing a portion of the conductive material to form a conductive structure having a barrel shape. A width of a body portion of the conductive structure is gre...

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Hauptverfasser: SHIH, YU-LUNG, KUO, POANG, LIN, YI-AN, CHANG, CHINGUAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SHIH, YU-LUNG
KUO, POANG
LIN, YI-AN
CHANG, CHINGUAN
description A method of manufacturing a semiconductor structure is provided. The method includes depositing a conductive material over a substrate, and removing a portion of the conductive material to form a conductive structure having a barrel shape. A width of a body portion of the conductive structure is greater than a width of an upper portion and a width of a bottom portion of the conductive structure.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method of manufacturing a semiconductor structure
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