Method of manufacturing a semiconductor structure
A method of manufacturing a semiconductor structure is provided. The method includes depositing a conductive material over a substrate, and removing a portion of the conductive material to form a conductive structure having a barrel shape. A width of a body portion of the conductive structure is gre...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A method of manufacturing a semiconductor structure is provided. The method includes depositing a conductive material over a substrate, and removing a portion of the conductive material to form a conductive structure having a barrel shape. A width of a body portion of the conductive structure is greater than a width of an upper portion and a width of a bottom portion of the conductive structure. |
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