Flip chip bonder and method for manufacturing semiconductor device

Flip chip bonder and method for manufacturing semiconductor device

According to the present invention, provided is a flip chip bonder, which can wash a die. The flip chip bonder comprises: a die supply unit for maintaining and supporting a die having a bump; a bonding stage for loading the die on a substrate or a pre-mounted die; a first head for picking the die up...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MAKI, HIROSHI, YAMAGAMI, TAKASHI, KANAI, SHOJI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:According to the present invention, provided is a flip chip bonder, which can wash a die. The flip chip bonder comprises: a die supply unit for maintaining and supporting a die having a bump; a bonding stage for loading the die on a substrate or a pre-mounted die; a first head for picking the die up from the die supply unit to enable the die to be upside down; a second head for picking the die up from the first head; and a washing machine to wash the die located between the die supply unit and the bonding stage using dry ice.