Resin composition for extrusion lamination, multilayer film, lid, and method for manufacturing multilayer film

Provided is a resin composition for extrusion lamination, the resin composition containing: a high pressure-processed low-density polyethylene; and an ethylene-vinyl acetate copolymer, wherein the resin composition has a melt flow rate of at least 10 g/10 min and less than 30 g/10 min as measured un...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	MANAMI, TOSHIHIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided is a resin composition for extrusion lamination, the resin composition containing: a high pressure-processed low-density polyethylene; and an ethylene-vinyl acetate copolymer, wherein the resin composition has a melt flow rate of at least 10 g/10 min and less than 30 g/10 min as measured under conditions of a load of 21.18 N and a temperature of 190 DEG C, has a melt flow rate ratio of at least 33 and less than 50, and has a molecular weight distribution of at least 3.5 and less than 6.0, and the content of a vinyl acetate-based monomer unit contained in the resin composition is 10-20 wt%, with the total weight of resin components contained in the resin composition being 100 wt%.