Burr trimming system and method thereof

A burr trimming system includes a positioning platform and a laser machine. A wafer with burr on an edge thereof is placed on the positioning platform. The laser machine is disposed on one side of the positioning platform and projects a laser beam from a position which includes a projecting angle wi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	CHU, SHIHIEH, LIN, YU-JHEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A burr trimming system includes a positioning platform and a laser machine. A wafer with burr on an edge thereof is placed on the positioning platform. The laser machine is disposed on one side of the positioning platform and projects a laser beam from a position which includes a projecting angle with the positioning platform, so as to trim the burr on the wafer.