Substrate structure and the manufacture thereof
Provided is a substrate structure, comprising: a substrate body, an insulating portion disposed on one side of the substrate body, a conductive layer disposed in the insulating portion, a conductive via hole formed in the substrate body and electrically connected to the conductive layer, and a metal...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | Provided is a substrate structure, comprising: a substrate body, an insulating portion disposed on one side of the substrate body, a conductive layer disposed in the insulating portion, a conductive via hole formed in the substrate body and electrically connected to the conductive layer, and a metal layer formed on the other side of the substrate body and electrically connected to the conductive via hole, thereby strengthening the substrate structure. The invention further provides a method for manufacturing the substrate structure as described above. |
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